0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
W25Q256JVEIM TR

W25Q256JVEIM TR

  • 厂商:

    WINBOND(华邦)

  • 封装:

    WDFN8

  • 描述:

    IC FLASH 256MBIT SPI/QUAD 8WSON

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q256JVEIM TR 数据手册
W25Q256JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: August 03, 2017 Revision G W25Q256JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 4. 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET)(1) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 6.2 7. SPI Operations ................................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 Write Protection .................................................................................................................. 13 STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) – Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) – Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) – Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) – Volatile/Non-Volatile Writable .......................................................... 17 -1- W25Q256JV 7.2 8. 7.1.5 Current Address Mode (ADS) – Status Only ..................................................................... 18 7.1.6 Power-Up Address Mode (ADP) – Non-Volatile Writable .................................................. 18 7.1.7 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ....................................... 18 7.1.8 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ........................... 19 7.1.9 Reserved Bits – Non Functional ........................................................................................ 19 7.1.10 W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 0) ............................. 20 7.1.11 W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 1) ............................. 21 7.1.12 W25Q256JV Individual Block Memory Protection (WPS=1) .............................................. 22 Extended Address Register – Volatile Writable Only ...................................................... 23 INSTRUCTIONS ............................................................................................................................. 24 8.1 8.2 Device ID and Instruction Set Tables ................................................................................. 24 8.1.1 Manufacturer and Device Identification ................................................................................ 24 8.1.2 Instruction Set Table 1 (Standard/Dual/Quad SPI, 3-Byte Address Mode)(1) ....................... 25 8.1.3 Instruction Set Table 2 (Dual/Quad SPI Instructions,3-Byte Address Mode) ....................... 26 8.1.4 Instruction Set Table 3 (Standard SPI, 4-Byte Address Mode)(1).......................................... 27 8.1.5 Instruction Set Table 4 (Dual/Quad SPI Instructions, 4-Byte Address Mode) ...................... 28 Instruction Descriptions ...................................................................................................... 30 8.2.1 Write Enable (06h) ............................................................................................................... 30 8.2.2 Write Enable for Volatile Status Register (50h) .................................................................... 30 8.2.3 Write Disable (04h) ............................................................................................................... 31 Figure 7. Write Disable Instruction for SPI Mode .............................................................................. 31 8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 31 8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 32 8.2.6 Read Extended Address Register (C8h) .............................................................................. 34 8.2.7 Write Extended Address Register (C5h) .............................................................................. 35 8.2.8 Enter 4-Byte Address Mode (B7h) ........................................................................................ 36 8.2.9 Exit 4-Byte Address Mode (E9h) .......................................................................................... 36 8.2.10 Read Data (03h) ................................................................................................................. 37 8.2.11 Read Data with 4-Byte Address (13h) ................................................................................ 38 8.2.12 Fast Read (0Bh) ................................................................................................................. 39 8.2.13 Fast Read with 4-Byte Address (0Ch) ................................................................................ 40 8.2.14 Fast Read Dual Output (3Bh) ............................................................................................. 41 8.2.15 Fast Read Dual Output with 4-Byte Address (3Ch) ............................................................ 42 8.2.16 Fast Read Quad Output (6Bh) ............................................................................................ 43 8.2.17 Fast Read Quad Output with 4-Byte Address (6Ch) ........................................................... 44 8.2.18 Fast Read Dual I/O (BBh) ................................................................................................... 45 8.2.19 Fast Read Dual I/O with 4-Byte Address (BCh) .................................................................. 46 8.2.20 Fast Read Quad I/O (EBh) ................................................................................................. 47 8.2.21 Fast Read Quad I/O with 4-Byte Address (ECh) ................................................................ 48 8.2.22 Set Burst with Wrap (77h) .................................................................................................. 49 8.2.23 Page Program (02h) ........................................................................................................... 50 8.2.24 Page Program with 4-Byte Address (12h) .......................................................................... 51 -2- Publication Release Date: August 03, 2017 Revision G W25Q256JV 9. 8.2.25 Quad Input Page Program (32h) ........................................................................................ 52 8.2.26 Quad Input Page Program with 4-Byte Address (34h) ....................................................... 53 8.2.27 Sector Erase (20h) ............................................................................................................. 54 8.2.28 Sector Erase with 4-Byte Address (21h)............................................................................. 55 8.2.29 32KB Block Erase (52h) ..................................................................................................... 56 8.2.30 64KB Block Erase (D8h) ..................................................................................................... 57 8.2.31 64KB Block Erase with 4-Byte Address (DCh) ................................................................... 58 8.2.32 Chip Erase (C7h / 60h) ....................................................................................................... 59 8.2.33 Erase / Program Suspend (75h) ......................................................................................... 60 8.2.34 Erase / Program Resume (7Ah) ......................................................................................... 61 8.2.35 Power-down (B9h) .............................................................................................................. 62 8.2.36 Release Power-down / Device ID (ABh) ............................................................................. 63 8.2.37 Read Manufacturer / Device ID (90h) ................................................................................. 64 8.2.38 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 65 8.2.39 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 66 8.2.40 Read Unique ID Number (4Bh)........................................................................................... 67 8.2.41 Read JEDEC ID (9Fh) ........................................................................................................ 68 8.2.42 Read SFDP Register (5Ah) ................................................................................................ 69 8.2.43 Erase Security Registers (44h) ........................................................................................... 70 8.2.44 Program Security Registers (42h) ...................................................................................... 71 8.2.45 Read Security Registers (48h) ........................................................................................... 72 8.2.46 Individual Block/Sector Lock (36h) ..................................................................................... 73 8.2.47 Individual Block/Sector Unlock (39h) .................................................................................. 74 8.2.48 Read Block/Sector Lock (3Dh) ........................................................................................... 75 8.2.49 Global Block/Sector Lock (7Eh) .......................................................................................... 76 8.2.50 Global Block/Sector Unlock (98h) ....................................................................................... 76 8.2.51 Enable Reset (66h) and Reset Device (99h) ...................................................................... 77 ELECTRICAL CHARACTERISTICS ............................................................................................... 78 9.1 Absolute Maximum Ratings (1) .......................................................................................... 78 9.2 Operating Ranges............................................................................................................... 78 9.3 Power-up Power-down Timing and Requirements ............................................................. 79 9.4 DC Electrical Characteristics .............................................................................................. 80 9.5 AC Measurement Conditions .............................................................................................. 81 9.6 AC Electrical Characteristics(6) ........................................................................................... 82 9.7 AC Electrical Characteristics (cont’d) .............................................................................. 83 9.8 Serial Output Timing ........................................................................................................... 84 9.9 Serial Input Timing .............................................................................................................. 84 9.1 /WP Timing ......................................................................................................................... 84 9.2 PACKAGE SPECIFICATIONs ............................................................................................ 85 9.3 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 85 9.4 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 86 -3- W25Q256JV 10. 9.5 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) ........................................... 87 9.6 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) .............................................. 88 9.7 Ordering Information........................................................................................................... 89 9.8 Valid Part Numbers and Top Side Marking ........................................................................ 90 REVISION HISTORY ...................................................................................................................... 91 -4- Publication Release Date: August 03, 2017 Revision G W25Q256JV 1. GENERAL DESCRIPTIONS The W25Q256JV (256M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q256JV array is organized into 131,072 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q256JV has 8,192 erasable sectors and 512 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. The W25Q256JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3. SPI clock frequencies of W25Q256JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64bit Unique Serial Number and three 256-bytes Security Registers. 2. FEATURES  New Family of SpiFlash Memories – W25Q256JV: 256M-bit / 32M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1, – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – 3 or 4-Byte Addressing Mode – Software & Hardware Reset(1)  Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Highest Performance Serial Flash – 133MHz Standard/Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Quad Peripheral Interface – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply –
W25Q256JVEIM TR
物料型号:W25Q256JV

器件简介: - 该器件是Winbond生产的SPI Flash Memory,具有256M-bit的存储容量。 - 设计用于空间、引脚和功率受限的系统,提供灵活性和性能。 - 适用于代码阴影到RAM、直接从Dual/Quad SPI执行代码以及存储声音、文本和数据。

引脚分配: - 提供了三种封装类型:WSON 8x6-mm、SOIC 300-mil和两种TFBGA 8x6-mm。 - 每种封装类型的引脚分配和描述在文档中有详细说明。

参数特性: - 支持标准SPI、Dual SPI和Quad SPI操作。 - 支持高达133MHz的SPI时钟频率,Dual I/O和Quad I/O的等效时钟频率分别为266MHz和532MHz。 - 具有低功耗特性,断电状态下电流消耗低至1µA。 - 工作温度范围为-40°C至+85°C。

功能详解: - 支持3字节和4字节地址模式,以访问整个内存阵列。 - 提供了包括页编程、扇区擦除、块擦除和芯片擦除在内的多种编程和擦除指令。 - 支持软件和硬件重置,以及硬件/RESET引脚(特定封装)。

应用信息: - 适用于需要高速数据传输和低功耗的应用,如工业控制、消费电子和汽车电子。

封装信息: - 提供了详细的封装尺寸和规格,以便于在设计时选择合适的封装类型。
W25Q256JVEIM TR 价格&库存

很抱歉,暂时无法提供与“W25Q256JVEIM TR”相匹配的价格&库存,您可以联系我们找货

免费人工找货
W25Q256JVEIM TR
  •  国内价格
  • 1+32.40467
  • 10+29.91200
  • 30+29.41347

库存:5

W25Q256JVEIM TR
  •  国内价格 香港价格
  • 4000+18.822824000+2.26062

库存:2133

W25Q256JVEIM TR
  •  国内价格 香港价格
  • 1+28.947161+3.47654
  • 10+25.6989110+3.08643
  • 25+24.5076025+2.94335
  • 50+23.6424050+2.83944
  • 100+22.80623100+2.73902
  • 250+21.74633250+2.61173
  • 500+20.97684500+2.51931
  • 1000+20.233611000+2.43005

库存:2133